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• High tin content provides excellent soldering performance and reliable solder joints.
• Syringe design enables precise application to avoid excessive solder paste and circuit contamination.

Baku® BGA Solder Paste Syringe – Leaded Alloy Sn63/Pb37, 25–45μm Particle Size

SKU: BA-6351

EGP445.00

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Baku® BGA Solder Paste Syringe – Leaded Alloy Sn63/Pb37, 25–45μm Particle Size

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