This solder wire is manufactured from a high-performance Sn70/Pb30 alloy, providing excellent melting characteristics, reliable bonding, and strong mechanical joints. With its integrated flux core and 0.6 mm diameter, it delivers precise, clean, and stable results—ideal for technicians, repair shops, and electronics assembly.
Key Features
Sn70 / Pb30 Alloy – balanced melting temperature and strong solder joints
Smooth, fast solder flow for consistent, shiny connections
Integrated rosin flux core for easy wetting and minimal residue
Ideal for delicate PCB components and precision electronics
Available in two spool sizes:
50 grams – light, portable, perfect for on-site repairs
100 grams – cost-efficient for workshop daily use
Technical Specifications
Alloy Composition: 70% Tin (Sn) / 30% Lead (Pb)
Diameter: 0.6 mm
Flux Core: Rosin-based
Melting Point: Approx. 183–190°C
Applications:
PCB soldering & rework
Electrical wire joints
Arduino & robotics projects
General electronic assembly & maintenance
Repair shops and industrial maintenance centers

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